Apple has signed a $30 billion agreement with Broadcom to buy custom wireless chips manufactured in the United States, describing them as components "for a wide range of Apple products." The deal matters because it represents the single largest commitment Apple has made under its pledge to invest up to $600 billion in the domestic technology supply chain, a promise made amid the threat of tariffs and pressure to expand US-based manufacturing.

Of the total, $1.5 billion will go towards upgrading Broadcom's facility in Fort Collins, Colorado, which will produce "advanced radio frequency components," and the companies say the arrangement will lead to the production of 15 billion US-made chips. The firms have offered few specifics beyond references to "advanced wireless connectivity technologies," though the release highlights FBAR filters, a proprietary Bulk Acoustic Wave technology used to filter wireless bands in smartphones. Notably, Broadcom does not own extensive manufacturing capacity itself and outsources production to third parties such as TSMC, while the two companies already have a long history of collaboration on RF, Wi-Fi and Bluetooth silicon. Further large deals are expected over the next three years.